LOCTITE ECCOBOND 3707
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- UV & Heat cure
- One component
- BGA cornerbond
Product Description
LOCTITE ECCOBOND 3707 UV curable edgebond is designed for bonding various types of electronic components on a PCB. It mainly plays a structural role in the packaging process.
LOCTITE ECCOBOND 3707 is a white, single component epoxy that is typically used for UV Curable CSP (Chip Scale Packages) and as a BGA (Ball Grid Array) Cornerbond.
UV Cure:
- >3,000mJ or
- >30 seconds @ 100 mW/cm²
Minimum intensity of 100 mW/cm² is recommended for the UV lamp
Oven Cure:
- 2 minutes @ 130°C
3707
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- LOCTITE ECCOBOND 3707
- LOCTITE ECCOBOND 3707
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
UV/Light Cure Strengths
- One component
- No solvents
- Very fast room temperature cure
- Cure on demand-facilitates parts alignment
- Less equipment space and energy
- Fast through put-low WIP
UV/Light Cure Limitations
- Sensitive to light-requires special space lighting
- Oxygen inhibits cure
- Line of sight cure- shadowed areas require secondary cure
- High CTE- fillers used to lower CTE block UV/light
