LOCTITE 3875
Harmonization Code : 3906909090 | Acrylic polymers in primary form Others>Others
Main features
- Two components
- Thermally conductive
- For transistors, rectifiers and power devices
Product Description
LOCTITE 3875 bead-on-bead, thermally conductive adhesive is designed to thermally couple and structurally bond heats sinks to heat dissipating electronic components. It is formulated to cure when the two components come into contact with one another, requiring no primer or heat.
LOCTITE 3875 is a two component acrylate, that is easy to use and can cure at room temperature. It is typically used for thermal management in transistors, rectifiers and computing applications such as memory chips, chipsets and gpu assemblies.
Cure Schedule
- 24 to 72 hours @ 23°C , 50% RH
3875
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TDS, SDS & Technical Documents
- TDS LOCTITE 3875 A-on-B issue 05-18
- MSDS LOCTITE 3875 PTA issue 08-15 (EN)
- MSDS LOCTITE 3875 PTB issue 09-18 (EN)
Technical Specifications
General Properties
Thermal Properties
Additional Information
Change in thermal resistance (%)
Thermal Exposure (1000 hours)
@25°C
| Ceramic | 4.5 |
| Silicon | -7.6 |
| Mold Compound | -0.3 |
| Contaminated Mold Compound | 4.4 |
@125°C
| Ceramic | 8.0 |
| Silicon | -3.5 |
| Mold Compound | -0.7 |
| Contaminated Mold Compound | -4.1 |
