LOCTITE ECCOBOND 50300HT

LOCTITE® ECCOBOND 50300HT is designed for glob top encapsulation of wire bonded bare die on epoxy laminate and similar substates. The formulation of this single component material ensures a long pot and a very stable viscosity during use.

LOCTITE® ECCOBOND 50300HT is a low viscosity, low CTE product that is recommended for use on ICs with high wire profiles and in applications where the spreading of the glob top during cure must be controlled.

Cure Schedule

• 2 hours @ 150°C

Low Stress Cure Schedule

• 1 hour @ 120°C + 1 hour @ 150°C

For best results, substrate should be preheated (up to a maximum of 70ºC) to obtain the optimum flow under and around the wires.