LOCTITE ECCOBOND 50300LT
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High wire profile
- Less thixotropic
- Glob top
Product Description
LOCTITE ECCOBOND 50300LT glob top is designed for encapsulating wire bonded bare die on epoxy laminate and similar substates. The formulation of this single component material ensures a long pot and a very stable viscosity during use.
LOCTITE ECCOBOND 50300LT is recommended for use large ICs with high wire profile. It is the less thixotropic version of LOCTITE ECCOBOND 50300HT and LOCTITE ECCOBOND 50300-1.
Cure Schedule
- 2 hours @ 150°C
Low Stress Cure Schedule
- 1 hour @ 120°C + 1 hour @ 150°C
For best results, substrate should be preheated (up to a maximum of 70ºC) to obtain the optimum flow under and around the wires.
Packaging
TDS, SDS & Technical Documents
- ECCOBOND 50300LT-EN
- 1189597_MSDS_UT_GB_EN
Technical Specifications
General Properties
Thermal Properties
Physical Properties
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