LOCTITE ABLESTIK 563K
Harmonization Code : 3920.99.28.90 | Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other
Main features
- Good heat transfer
- Low squeeze out
- Thermally conductive
Product Description
LOCTITE ABLESTIK 563K epoxy adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high strength over a wider temperature range than is normally associated with flexible films.
LOCTITE ABLESTIK 563K is a thermally conductive film with good heat transfer which manages to achieve a thin bondline with uniform bondline control. It comes without a carrier and is typically available in 50um and 75um microns.
Cure Schedule
- 30 minutes @ 150°C
- 2 hours @ 125°C
563K
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 20 days
Shipping in 12 weeks
Shipping in 45 daysPackaging
TDS, SDS & Technical Documents
- TDS LOCTITE ABLESTIK 563K issue 11-19
- MSDS LOCTITE ABLESTIK 563K-003 issue 04-18 (EN)
- LOCTITE ABLESTIK 563K-003 known as Ablefilm 563K-0
- SDS-LOCTITE-ABLESTIK-563K-FR
Technical Specifications
General Properties
Thermal Properties
Additional Information
Outgassing
NASA Outgassing:
- TML, % 0.44
- CVCM, % 0.04
- WVR, % 0.2
Recently viewed products
LOCTITE ABLESTIK 8008
- Snap curable after B stage
- Low modulus
- Void free bondline without bleed
Honeywell TA 3000
- Moisture cure
- Good thermal performance
- Adjusts to irregular surfaces
ABchimie DVU Urethane Thinner
- Formulated for urethane‑based conformal coatings
- For dip coating and spray coating applications
- Consistent, stable solvent composition
