LOCTITE ABLESTIK 566K
Harmonization Code : 3920.99.28.90 | Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other
Main features
- Extremely flexible film
- Bond disimilar materials
- Thermally conductive
Product Description
LOCTITE ABLESTIK 566K is a white, heat curable epoxy film, designed for bonding disimilar materials with mismatched coefficients of thermal expansion. It is electrically insulating, extremely flexible and cures in a low temperature. In fact, the lowest temperature curing and dielectric assembly film with enhanced ~1 W/m-K thermal conductivity we can offer is LOCTITE ABLESTIK 566K.
LOCTITE ABLESTIK 566K is a low temperature cure version of LOCTITE ABLESTIK 561K adhesive. It is mainly used for heat sink assembly and has a glass fabric carrier.
Cure Schedule
- 2 hours @ 100°C
- 3 hours @ 90°C (2 - 10psi for void free bondline)
566K
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TDS, SDS & Technical Documents
- LOCTITE ABLESTIK 566K
- LOCTITE ABLESTIK 566K
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
How does ABLESTIK 566K compare to ABLESTIK 561K?
The storage temperature of both materials is as low as -40 °C to guarantee its material properties over a longer range of time.
The 561K is a great reference material that can be stored at -40 °C for 12 months but can also be stored at ambient (25 °C) for up to 6 months without loss of performance.
The difference with 561K however, in the higher minimum cure schedule of 125 °C for 2 hours.
The 566K material can cure at 100 °C but this is achieved by an increased catalyst load making the material more reactive, giving it shorter shelf life. (We would expect -20 °C storage to be sufficient for the 566K for 3-6 months)
Essentially you end up with two options:
- Use 561K with 6 months storage at 25 °C and accept a higher 125 °C cure
- Use 566K with 3-6 months storage at -20 °C and cure at 100 °C
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