LOCTITE ABLESTIK 8-2
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Thermally conductive
- Positive under UV light
- For MEMs packages
Product Description
LOCTITE ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. Bonds made with LOCTITE ABLESTIK 8-2 can withstand continuous exposure @ 150 °C and intermittent exposure @ 200°C.
Cure Schedule
- 1.5hours @ 95ºC
- 45 minutes @ 120°C or
- 4 hours @ 75°C or
- 24 hours @ 60°C
8-2
1. Select Package Type
2. Select Package Size
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TDS, SDS & Technical Documents
- ABLESTIK 8-2-EN
- 1190127_MSDS_UT_US_EN
Technical Specifications
General Properties
Specific Gravity Specific Gravity
2.3 Work life @25°C Work life @25°C
4 hours Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
92 °C Thermal Conductivity Thermal Conductivity
1.5 W/m.K Weight Loss @ 300°C Weight Loss @ 300°C
0.1 % 
