LOCTITE ABLESTIK 8175
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Stress absorbing
- Pb free Solder replacement
- Stencil or Screen printable
Product Description
LOCTITE ABLESTIK 8175 is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metallizations or traditional printed circuit board surfaces. It is capable of resolving fine pitch resolution (0.02 inch) when printed using either a stainless steel mesh screen or a metal mask stencil.
LOCTITE ABLESTIK 8175 meets the requirements of MIL-STD-883, Method 5011. It is a stress absorbing, electrically and thermally conductive epoxy adhesive that is typically used for die attach. This is a stencil and screen printable Pbfree alternative to solder.
Cure Schedule
- 30 minutes @ 150°C
- 60 minutes @ 150°C (for bondlines lower than 1mil)
- 60 minutes @ 130°C
8175
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TDS, SDS & Technical Documents
- MSDS LOCTITE ABLESTIK 8175 issue 11-18 (EN)
- TDS LOCTITE ABLESTIK 8175 issue 10-14
