LOCTITE ABLESTIK 8387BM
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Fast cure
- 2 in 1
- Die attach and Glob top
Product Description
LOCTITE® ABLESTIK 8387BΜ non conductive epoxy die attach adhesive has been formulated for use in high throughput die attach applications. It has been used for the glass attach of Optical and 3D sensors and has been successfully used for lid attach in aerospace and defence applications. This non conductive adhesive can be used as an encapsulant and has black pigmentation for blocking stray light. It can be used to bond Nickel-plated surfaces on FR4.
LOCTITE® ABLESTIK 8387BΜ is a low temperature cure material that has the unique ability to be a 2 in 1 solution for both die attach and glob top encapsulation applications.
Cure Schedule
- 1 hour @ 100°C
- 90 minutes @ 90°C
8387BM
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TDS, SDS & Technical Documents
- ABLESTIK 8387BM-EN
- 1528954_MSDS_UT_US_EN
