LOCTITE ABLESTIK 958-7 | Electrically Conductive Adhesive
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Electrically conductive
- Good adhesion to gold
- Heat cure
Product Description
LOCTITE ABLESTIK 958-7 is a silver-filled, electrically conductive epoxy adhesive engineered for high-reliability hybrid die attach applications. Formulated for advanced electronic assemblies, this adhesive delivers both strong mechanical bonding and consistent electrical performance, even under thermal and environmental stress.
What sets 958-7 apart is its enhanced adhesion to gold surfaces, making it particularly well-suited for sensitive components in hybrid circuits, semiconductors, and high-density electronics. Its proven track record in reliability makes it a go-to solution for manufacturers that demand dependable electrical conductivity along with robust bond strength.
Typical Applications:
- Hybrid Die Attach
- High-Reliability Electronics
- RF and Microwave Components
958-7
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- LOCTITE-ABLESTIK-958-7-en_GL
- LOCTITE-ABLESTIK-958-7-en_GL_SDS
- CAPLINQ Die Attach Paste Handling Guide
Technical Specifications
General Properties
Electrical Properties
Chemical Properties
Physical Properties
Thermal Properties
Additional Information
LOCTITE ABLESTIK 958-7 ADDITIONAL SPECIFICATIONS
| Property | Value | Unit |
| Lap Shear Strength @25℃ (Al to Al) | 14 | N/mm2 |
| Bond Strength @25℃ | 39 | N/mm2 |
| Bond Strength @25℃ (after 1,000 hours @150℃) | 37 | N/mm2 |
Recommended Cure Schedule
- 1 hour @150°C
Thawing
- Allow container to reach room temperature before use.
- After removing from the freezer, set the syringes to stand vertically while thawing.
- DO NOT open the container before contents reach 25°C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.
- DO NOT re-freeze. Once thawed to 25°C, the adhesive should not be re-frozen.
Directions for Use
- Thawed adhesive should immediately be placed on dispense equipment for use.
- If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive.
- Adhesive must be completely used within the product's recommended work life.
- Apply enough adhesive to achieve a 25 to 50 µmwet bondline thickness, dispensed with approximately 25 to 50 % filleting on all sides of the die.
- Alternate dispense amounts may be used depending onthe application requirements.
- Star or crossed shaped dispense patterns will yield fewerbondline voids than the matrix style of dispense pattern.
