ABchimie CIPEX50 Aqueous Base for PCB Cleaners
Harmonization Code : 2909.49.00 | Ethers, ether-alcohols, ether-phenols, etc., other than acyclic
Main features
- Highly concentrated aqueous cleaning formulation
- Low‑foaming formula
- High cleaning efficiency
Product Description
ABchimie CIPEX 50 is a concentrated version of the CIPEX cleaning chemistry, formulated for dilution and high‑performance removal of flux residues and solder pastes on PCBs after reflow. It is designed for use in both ultrasonic cleaning systems and pressure spray wash equipment, making it suitable for a wide range of SMT cleaning operations.
CIPEX 50 allows for concentration adjustments according to contamination level, equipment type, and process requirements, providing excellent flexibility and cost‑efficiency.
Product Key Features
- Highly concentrated aqueous cleaning formulation
- Designed for dilution according to process needs
- Low‑foaming formula suitable for ultrasonic and spray systems
- High cleaning efficiency for reflowed solder pastes and flux residues
Applications
- Post‑reflow PCB cleaning
- Ultrasonic tank cleaning
- Pressure spray washing (batch or in‑line systems)
ABC-CIPEX50
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TDS, SDS & Technical Documents
- CIPEX 40 and 50 TDS
- CIPEX 50 SDS
Technical Specifications
Thermal Properties
General Properties
Physical Properties
Additional Information
Reflow is a process in electronics manufacturing where solder paste is heated to melt and form reliable electrical connections between components and the printed circuit board (PCB). After heating, the solder cools and solidifies, securing the components in place.
During reflow, flux from the solder paste leaves behind residues on the PCB. These residues can affect electrical performance, cause corrosion, or impact reliability over time. Cleaning removes these contaminants, ensuring optimal functionality, long-term reliability, and a clean final product.
Types of Cleaning
Why is PCB Cleaning Required?
After reflow soldering, the PCB (printed circuit board) is cleaned to remove any leftover flux and solder paste residues.
Even though the solder is solidified and the components are attached, flux residues can be sticky or corrosive, and over time they can:
- Causes electrical leakage or short circuits
- Promote corrosion on metal surfaces
- Affect the board’s reliability and appearance
Using a cleaner like CIPEX 40 or 50, the PCB is washed to remove all residues and leave the board clean and ready for use or further assembly.
Uses pressurized jets of cleaning fluid to remove residues from surfaces and components. Effective for fast, uniform cleaning of larger areas and external parts.
Cleaning is performed directly within the equipment without disassembly, allowing the system to remain in operation or quickly return to service. Ideal for minimizing downtime in continuous production environments.
Employs high-frequency sound waves in a liquid bath to create microscopic cavitation bubbles that dislodge contaminants. Perfect for precision cleaning of small or complex components with hard-to-reach areas.
Cleaning Instructions for CIPEX 50
These cycles are given as indicative and will be optimized based equipment and types of streams to be processed.
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