LOCTITE ABLESTIK ABP 6892BA
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Designed for Fingerprint Sensors
- Low stress for ultra thin glass
- Low outgassing and filler free
Product Description
LOCTITE ABLESTIK ABP 6892BA non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package or device using this material will have a high resistance to delamination and popcorning after multiple exposures to Pb-free solder reflow temperatures. This material provides excellent adhesion to a variety of surfaces.
LOCTITE ABLESTIK ABP 6892BA is a transparent, low-temperature cure BMI acrylate without a filler. This, along with its low stress and low moisture absorption make it ideal for optical applications. It can be used both as a die attach paste but also for component assembly and fingerprint sensors, among other things.
Cure Schedule
- 15 minutes ramp to 80ºC, hold 60 minutes or
- 15 minutes ramp to 130ºC, hold 30 minutes
ABP6892BA
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeksPackaging
TDS, SDS & Technical Documents
- ABLESTIK ABP 6892 BA-EN
- 2594374_MSDS_UT_US_EN
