LOCTITE ABLESTIK ABP 8060T
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- High heat transfer
- Soft solder replacement
- Stable at high temperatures
Product Description
LOCTITE® ABLESTIK ABP 8060T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring very high thermal and electrical conductivity.
LOCTITE® ABLESTIK ABP 8060T is a hydrophobic, electrically and thermally conductive BMI hybrid that is stable at high temperatures. This silver paste it typically used for MOSFET packages and exhibits high die shear strength.
Cure Schedule
- 45 minutes ramp from 25°C to 200°C + 60 minutes @ 200°C in N2 or air oven
- 30 minutes ramp from 25°C to 175°C + 60 minutes @ 175°C in N2 or air oven
ABP8060T
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TDS, SDS & Technical Documents
- ABLESTIK ABP 8060T-EN
- 1700749_MSDS_UT_GB_EN
- LOCTITE ABLESTIK ABP 8060T known as ABP 8060T(18g)
- LOCTITE ABLESTIK ABP 8060T known as ABP 8060T(18g)
- CAPLINQ Die Attach Paste Handling Guide
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
It's stated in the TDS that it needs a N2 oven. Is this a prerequisite? Can it be cured in a conventional oven and if so how will this change the cure schedule?
Many customers prefer to cure in Nitrogen, to protect components from oxidation. But curing both in Air or Nitrogen is still OK. Die shear strength is not significantly affected by the curing atmosphere.
