LOCTITE ABLESTIK ABP8303A
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- High die shear strength
- Low outgassing
- Ideal for large die sizes
Product Description
LOCTITE ABLESTIK ABP 8303A silver filled, conductive die attach adhesive is recommended for use in bonding integrated circuits and components to metal substrates. ABLESTIK ABP 8303A has moderate modulus, high adhesion and low stress, enabling robust bonding of medium/large sized dice on a wide variety of metal surfaces, including Cu, Ag and PPF.
LOCTITE ABLESTIK ABP 8303A is particularly suitable for packages in which tight control of resin bleed out is required. The material is hydrophobic and stable at high temperatures.
Cure Schedule
- 30 minute ramp to 175°C plus 60 minutes @ 175 °C in N2 oven
ABP8303A
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TDS, SDS & Technical Documents
- TDS LOCTITE ABLESTIK ABP 8303A issue 08-20
- LOCTITE ABLESTIK ABP 8303A Data package
- 8303A TMA DMA DSC TGA
- LOCTITE ABLESTIK ABP 8303A
- LOCTITE ABLESTIK ABP 8303A NL-MSDS_UT_NL
- LOCTITE ABLESTIK ABP 8303A EN-MSDS_UT_EN
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Additional Information
Cure Schedule
- 30 minute ramp to 175°C plus 60 minutes @ 175 °C in N2 oven.
Thawing
- Allow container to reach room temperature before use.
- After removing from the freezer, set the syringes to stand vertically while thawing.
- Refer to the Syringe Thaw time chart for the thaw time recommendation.
- DO NOT open the container before contents reach 25°C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.
- DO NOT re-freeze. Once thawed to -40°C, the adhesive should not be re-frozen.
Directions for Use
- Thawed material should immediately be placed on dispense equipment for use.
- If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive.
- Adhesive must be completely used within the product's recommended work life.
- Silver-resin separation may occur if the adhesive is left out at room temperature, beyond the recommended work life.
- Apply enough adhesive to achieve a 50 μm wet bondline thickness, dispensed with approximately 25 to 50 % filleting on all sides of the die.
- Alternate dispense amounts may be used depending on the application requirements.
- Star or crossed shaped dispense patterns will yield fewer bondline voids than the matrix style of dispense pattern.
