LOCTITE ABLESTIK ABP 8910T
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- High MRT performance
- High thermal conductivity
- BMI Hybrid
Product Description
LOCTITE® ABLESTIK ABP 8910T die attach adhesive is formulated with a medium modulus using BMI hybrid chemistry and is targeted for use on medium to large die sizes.
LOCTITE® ABLESTIK ABP 8910T is an Alumina filled, electrically insulating adhesive that is ideal for Copper, Silver, PPF and Alloy 42 substrates. It has relatively higher thermal conductivity for die attach pastes at 1.3 W/mK.
Cure Schedule
- 30 minute ramp to 175°C + 15 minutes @ 175°C
ABP8910T
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TDS, SDS & Technical Documents
- LOCTITE ABLESTIK ABP 8910T
- MSDS 1594144 en_GB
