KESTER 979 Solder Flux
Harmonization Code : 29051200 | Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)
Main features
- Chemically compatible with most solder mask & laminates
- Does not degrade SIR
- Bellcore GR-78 Compliant
Product Description
Kester 979 is a VOC-free, no-clean flux formulated for producing high-quality, low-defect solder joints on electronic circuit board assemblies. Its advanced, finely tuned activation system delivers the best wetting performance available in VOC-free liquid flux technology, resulting in the shiniest solder joints possible.
Product Key Features
- Contains no volatile organic compounds for a safer workplace and reduced environmental impact.
- Superior wetting & joint appearance
- Leaves a minimal amount of residue after soldering, which is non-corrosive, non-conductive, and does not require removal
- Does not attack properly cured solder masks or standard FR-4 Epoxy-Glass laminate materials.
Applications
- Wave soldering & selective soldering
- Processes requiring low-residue fluxes
Note: Not compatible for use in a soldering process that does not have a preheat cycle associated with it, such as soldering with an iron.
Packaging
TDS, SDS & Technical Documents
- Kester-979-Soldering-Flux-LFX-TDS
- Kester-979-Soldering-Flux-LFX-SDS
- Kester-979-Soldering-Flux-SDS-Malay
Technical Specifications
General Properties
Additional Information
Flux Application
In Wave Soldering, Kester 979 can be applied to circuit boards by a spray, foam, or dip process. Flux deposition should be 120 to 240ug of solids/cm2 (750 to 1500ug of solids/in2). An air knife after the flux tank is recommended to remove excess flux from the circuit board and prevent dripping on the preheater surface. 979 does not work in foam application.
Surface Insulation Resistivity (SIR) Data
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