Kester K100LD Lead-Free Solder Wire
Harmonization Code : 8001.20 | Unwrought tin: Tin alloys
Main features
- Eutectic Sn/Cu alloy
- Controlled metallic dopants
- Refined grain structure
Product Description
KESTER K100LD is a eutectic Tin/Copper alloy engineered with controlled metallic dopants to refine the solder joint’s grain structure and reduce copper dissolution in the solder pot. This advanced formulation virtually eliminates common defects such as icicling and bridging. Its improved grain structure also produces noticeably shinier solder joints compared to traditional lead‑free alternatives.
Product Key Features
- Eutectic Sn/Cu Alloy: Provides consistent melting behavior and reliable soldering performance.
- Controlled Metallic Dopants: Reduces copper dissolution, extending solder pot life and maintaining alloy integrity.
- Refined Grain Structure: Enhances joint appearance and mechanical reliability.
Applications
- Wave Soldering Processes in both consumer and industrial electronics
- Selective Soldering Systems requiring stable, low‑defect alloys
AP-K100LDW
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TDS, SDS & Technical Documents
- Kester-Ultrapure-K100LD-Lead-Free-Solder-Alloy-EN-08Dec20-TB
- 408957456648_MAES 48 K100LD Solder Wire SDS GHS UN_English
- 408957456648_MAES 48 K100LD Solder Wire SDS GHS UN_Malay
Technical Specifications
Thermal Properties
Thermal Conductivity Thermal Conductivity
64 W/m.K 
