Kester TSF-6502JCR

Harmonization Code : 29051200 | Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)

Kester TSF-6502JCR

Main features

  • 8-hour stencil life
  • Printing up to <16mil pitch
  • ROL1 & Bellcore GR-78 compliant

Product Description

Kester TSF-6502JCR is a no-clean tacky soldering flux formulated for high activity and robust performance. TSF-6502JCR enables excellent soldering on challenging surfaces, even under multiple thermal cycles, while leaving clear, aesthetically pleasing residues.

Product Key Features

  • Stencil life: 8 hours (process dependent) 
  • Excellent printing characteristics to <16mil pitch 
  • Leaves bright/shiny solder joints after reflow 
  • Can reflow in air or nitrogen environments 
  • Classified as ROL1 per J-STD-004 
  • Compliant to Bellcore GR-78

Applications

  • Nickel Surface Soldering
  • OSP-Treated Copper Boards
  • Multi-Reflow Processes
Product Family

AP-TSF6502JCR

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Product availability
Shipping in 3 weeks
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TDS, SDS & Technical Documents
  • TSF-6502JCR TDS
    English (Technical Data Sheet (TDS))
  • TSF-6502JCR SDS
    English (Safety Data Sheet (SDS))

Technical Specifications

Physical Properties
Viscosity Viscosity
100000 mPa.s

Additional Information

Recommended Reflow Profile

Optimal activation temperatures are 150 to 210 °C (302 to 410 °F). See the Soak Zone in diagram below:

Reflow Profile

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