LOCTITE ABLESTIK ATB 125GR
Harmonization Code : 3920.99.28.90 | Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other
Main features
- Low ionic content
- Excellent adhesion on both metal lead frames and BGAs
- High modulus
Product Description
LOCTITE ABLESTIK ATB 125GR adhesive film is formulated for use in wafer lamination processess or as a preform decal. ABLESTIK ATB 125GR is a new non-conductive die attach adhesive film suitable for use on small to medium size die sizes, with improved reliability on 0.5×.5 to 3×3 mm die size running in volume production.
LOCTITE ABLESTIK ATB 125GR has an integratedd icing tape designed for consistent die pick up.
Product Key Features
- Excellent workability
- Excellent adhesion on both metal lead frames and BGAs
- Meets thin wafer requirements
- Recommended for small to medium die size packages
- Consistent dicing and die pickup for small to medium die applications
Applications
- Semiconductor film or non-conductive die attach film for IC, discrete, and chip stack packages
ATB125GR
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeksPackaging
TDS, SDS & Technical Documents
- LOCTITE-ABLESTIK-ATB-125GR-TDS
- LOCTITE-ABLESTIK-ATB-125GR-SDS
- Compliance letter_PFAS
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Additional Information
Properties of ATB 125GR versus ATB F125E
Recommended Cure Schedule
- 1 hour @175℃
Directions for Use
- Ensure all surfaces to be bonded are free from surface contamination.
- Adhesive must be completely used within the product's recommended work life.
- Remove the tape reel from the moisture-resistant package and load into the tape application machine.
- Store unused adhesive film in the original sealed moisture-resistant package until needed.
