LOCTITE ECCOBOND BF4
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Low moisture
- High Tg
- Epoxy backfill material
Product Description
LOCTITE ECCOBOND BF 4 BackFill epoxy adhesive is designed to encapsulate, protect and provide a structural bond for optoelectronic applications. This material compliments the use of AA50 and AA50T adhesives for active alignment of opto components. The combined use of light cure AA50T for active alignment and BF-4 for backfill provides a highly reliable alignment that can withstand changes in temperature and humidity. It is a black, non-conductive, epoxy adhesive designed to protect optoelectronic applications by encapsulating and providing a secure structural bond.
LOCTITE® ECCOBOND BF 4 is a low moisture, die attach adhesive that combines light cure AA50T and BF -4 to provide reliable alignment and raised ability to withstand temperature and humidity changes. The material offers good adhesion to plastic and low outgassing.
Cure Schedule
- 30 minutes @ 100°C
BF4
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 20 days
Shipping in 12 weeks
Shipping in 12 weeksPackaging
TDS, SDS & Technical Documents
- ECCOBOND BF 4-EN
- 1200432_MSDS_UT_US_EN
