CC-SAC305 | Copper Core SAC 305 Solder spheres

LINQALLOY CC-SAC305 solder Spheres are lead-free Tin/Silver/Copper alloys that contain 96.5% Tin (Sn), 3% Silver (Ag), and 0.5% Copper (Cu) and is often written as Sn96.5Ag3.0Cu0.5. These are not the normal SAC305 spheres since they have a copper core that enables "no tilt" designs and can act as a spacer for applications that require perfect BLT control. The size of the core depends on the diameter of the sphere.

LINQALLOY CC-SAC305 offers has excellent fatigue resistance and it is compatible with all flux types. It exhibits excellent joint reliability and it is the best wetting Sn/Ag/Cu alloy in the market.

Each jar has a clear label on the lid specifying the solder ball diameter as well as a label on the front identifying the alloy type, the quantity of spheres in the jar, the date of manufacture, and the product lot (or batch) number. This batch number is also tied to a certificate of conformance that is also provided with the solder spheres and ensures the SAC305 solder spheres meet the following quality criteria:

• Tin (Sn): 96.5%
• Silver (Ag): 3%
• Copper (Cu): 0.5%
• Melting Temperature (Solidus): 217°C
• Melting Temperature (Liquidus): 219°C
• Sphericity: Within 1.5%

Diameter Tolerance

• 0.22mm - 0.48mm (220µm - 480µm) : ± 0.010mm (± 10µm)
• 0.50mm - 0.762mm (500µm - 762µm) : ± 0.025mm (± 25µm)

Sphere diameter and Copper Core size reference

• 60 µm – 100 µm Core Copper
• 110 µm – 150 µm Core Copper
• 210 µm – 250 µm Core Copper