LOCTITE ABLESTIK CE3104WXL

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE ABLESTIK CE3104WXL

Main features

  • Pb Free alternative to solder
  • Electrically conductive
  • Optimized for printing

Product Description

LOCTITE ABLESTIK CE 3104WXL is an electrically conductive epoxy adhesive that is a Pb-free alternative to solder. It is a rigid, silver filled epoxy that can be heat cured in low temperatures and is typically used for SMD component attach on non-noble Sn, Sn/Pb and OSP coated Cu substrates.

LOCTITE ABLESTIK CE 3104WXL uses a unique blend of fillers with tightly controlled particle sizes to provide ultra-fine pitch resolution (<500µm) when printed using either a stainless steel mesh screen or a metal mask stencil. The lower surface tension versus solder means no bridging on fine-pitch assembly patterns.

Cure Schedule

  • Reflow:
    • 3 minutes @ 150°C or
    • 5 minutes @ 125°C
  • Convection:
    • 8 minutes @ 125°C or
    • 5 minutes @ 150°C
Product Family

CE3104WXL

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Product availability
US Shipping in 12 weeks
CA Shipping in 12 weeks
EU Shipping in 25 days
Packaging
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TDS, SDS & Technical Documents
  • LOCTITE ABLESTIK CE 3104WXL
    English (Technical Data Sheet (TDS))
  • LOCTITE ABLESTIK CE3104WXL SDS
    English (Safety Data Sheet (SDS))
  • LOCTITE ABLESTIK CE 3104WXL known as CE 3104 WXL 2
    Dutch (Safety Data Sheet (SDS))
  • Datapackage3103WLV-3104WXL
    English (Technical documents)
  • LOCTITE ABLESTIK CE 3104WXL known as CE 3104 WXL 25 G NL-MSDS_UT_NL
    Dutch (Safety Data Sheet (SDS))
  • LOCTITE ABLESTIK CE 3104WXL known as CE 3104 WXL 25 G NL-MSDS_UT_EN
    English (Safety Data Sheet (SDS))

Technical Specifications

General Properties
Work life @25°C Work life @25°C
72 hours
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
100 °C
Thermal Conductivity Thermal Conductivity
1.8 W/m.K
Physical Properties
Thixotropic index Thixotropic index
6
Viscosity Viscosity
65,000 mPa.s

Additional Information

In the following image you can see that the CE 3104WXL stencil printing results with 25um stencil showing that 80-100um dot diameter with 100um spacing (or 200um pitch) look good, but smaller dots and pitch are getting tricky.

The results are color coded so 100um spacing exhibits proper printing with larger dot diameters.

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