LOCTITE ABLESTIK CE8500
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Main features
- Flexible
- Low stress
- Bond mismatched substrates
Product Description
LOCTITE® ABLESTIK CE 8500 is a solventless epoxy adhesive that combines low stress with good adhesion on nearly all surfaces. This silver filled, electrically conductive, modified, epoxy offers low stress and can be used to bond mismatched adherents due to its flexibility.
LOCTITE® ABLESTIK CE 8500 can operate in temperatures ranging from -45°C to 200°C and due to its thermal conductivity is typically used for substrate attach, heat sink attach and sensor attach.
Cure Schedule
- 90 minutes @ 120°C or
- 40 minutes @ 150°C or
- 15 minutes @ 175°C
Packaging
TDS, SDS & Technical Documents
- ABLESTIK CE 8500-EN
- 1189575_MSDS_UT_GB_EN
Technical Specifications
Thermal Properties
Electrical Properties
Mechanical Properties
Chemical Properties
Physical Properties
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