LOCTITE ABLESTIK CE8500

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE ABLESTIK CE8500

Main features

  • Flexible
  • Low stress
  • Bond mismatched substrates

Product Description

LOCTITE® ABLESTIK CE 8500 is a solventless epoxy adhesive that combines low stress with good adhesion on nearly all surfaces. This silver filled, electrically conductive, modified, epoxy offers low stress and can be used to bond mismatched adherents due to its flexibility.

LOCTITE® ABLESTIK CE 8500 can operate in temperatures ranging from -45°C to 200°C and due to its thermal conductivity is typically used for substrate attach, heat sink attach and sensor attach.

Cure Schedule

  • 90 minutes @ 120°C or
  • 40 minutes @ 150°C or
  • 15 minutes @ 175°C

 

Product Family

CE8500

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Product availability
US Shipping in 34 days
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Packaging
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TDS, SDS & Technical Documents
  • ABLESTIK CE 8500-EN
    English (Technical Data Sheet (TDS))
  • 1189575_MSDS_UT_GB_EN
    English (Safety Data Sheet (SDS))

Technical Specifications

Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
24 °C
Thermal Conductivity Thermal Conductivity
4 W/m.K
Electrical Properties
Volume Resistivity Volume Resistivity
0.0002 Ohms⋅cm
Mechanical Properties
Elongation Elongation
10 %
Chemical Properties
Moisture absorption Moisture absorption
1.5 %
Physical Properties
Viscosity Viscosity
120,000 mPa.s

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