LINQBOND DA-8030 | Die-Attach
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Good electrical and thermal conductivity
- Excellent adhesion
- Outstanding manufacturability with low temperature cure
Product Description
LINQBOND DA-8030 is a single-component, silver-filled, electrically conductive die attach adhesive. It is engineered to provide exceptional thermal and electrical conductivity, ensuring efficient heat dissipation and reliable electrical connections. Its excellent adhesion properties allow for secure bonding to various substrates, such as metal and ceramic. Additionally, the modified epoxy's low-temperature curing capability minimizes thermal stress on components.
LINQBOND DA-8030 is designed as a die attach for thin packages such as memory cards, CCD and CMOS assemblies. It can also be used for other applications such as consumer electronics, automotive sensors, and diodes.
Cure Schedule
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60 minutes at 120°C
DA-8030
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
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TDS, SDS & Technical Documents
- TDS_LINQBOND DA-8030
Technical Specifications
General Properties
Electrical Properties
Physical Properties
Additional Information
DSC curve of DA-8030 showing peak crosslinking temperature at 130°C.
