LINQSOL EMC-1533 | Black Epoxy Molding Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LINQSOL EMC-1533 | Black Epoxy Molding Compound

Main features

  • Green molding compound
  • Designed for transistor outline (TO) and double decawatt (D2PAK) packages
  • Excellent workability, low water absorption, low modulus, and excellent thermal stability

Product Description

LINQSOL™ EMC-1533 is a halogen-free epoxy molding compound tailored for transistor Outline (TO) and D²PAK devices. Its low modulus minimizes package stress while maintaining a high glass-transition temperature of 170 °C for thermal stability. Its excellent flow characteristics enable smooth transfer molding. The compound also meets UL 94 V-0 flammability, ensuring robust safety margins. EMC-1533 boasts of its cost effectiveness and excellent workability with more than 500 continuous mold shots. 

LINQSOL™ EMC-1533 guarantees strong performance and outstanding long-term reliability in demanding environments. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, LINQSOL™ EMC-1533 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

LINQSOL™ EMC-1533 is available in pressed pellets in a wide range of sizes to meet specific customer needs. Contact us for more product information, custom sizes, or other specific requirements.

Key Features

  • Low Modulus, Low Stress: Reduces package warpage and wire-bond strain during thermal cycling.
  • High Tg 170 °C: Maintains mechanical strength at elevated junction temperatures.
  • Excellent Flowability: Fast 20 s gel time @ 175 °C supports high-yield transfer molding.
  • UL 94 V-0 Flame Rating: Ensures self-extinguishing behavior for consumer and industrial safety.
  • Halogen-Free & RoHS/REACH-Compliant: Avoids regulated substances for global market acceptance.
  • Proven Reliability: Passes 500 h HTRB, 98 h PCT and 500 thermal cycles for long-term durability.

Designed for

  • TO-220 (single & multi-lead power transistors, IGBTs)
  • TO-252 / DPAK (surface-mount MOSFETs, regulators)
  • TO-263 / D²PAK (high-current MOSFETs, Schottky diodes)
  • TO-247 (high-voltage discrete devices, rectifiers)

Reliability Tests Passed

  • HTRB, Tₐ=125°C, V=80%VR * 500 hour
  • PCT, Tₐ=121°C, P=0.215atm, RH=100%* 98 hours
  • Thermal Cycling Test, -55°C - +150°C * 500 cycles

LINQSOL™ EMC-1533 closely matches Hysol GR300, which shares a 170 °C Tg, 125 MPa flexural strength, and similar flow/gel characteristics, making it a practical drop-in alternative.

Product Family

EMC-1533

1. Select Package Type
2. Select Product Form
3. Select Pellet Size
4. Select Pellet Weight
Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Product availability
US Shipping in 2 weeks
CA Shipping in 2 weeks
EU Shipping in 2 weeks
Packaging
Please select Package Type, Product Form, Pellet Size and Pellet Weight before adding your product to your cart.
TDS, SDS & Technical Documents
  • TDS_LINQSOL EMC-1533
    English (Technical Data Sheet (TDS))

Technical Specifications

General Properties
Filler Content Filler Content
80 %
Filler Size Cut Filler Size Cut
75 µm
Specific Gravity Specific Gravity
1.9
Electrical Properties
Volume Resistivity Volume Resistivity
7.5E16 Ohms⋅cm
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
170 °C
UL 94 Rating UL 94 Rating
V-0
Mechanical Properties
Molded Shrinkage Molded Shrinkage
0.33 %
Chemical Properties
Moisture absorption Moisture absorption
0.4 %
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
68 cm

Additional Information

Recommended Mold Parameters

Parameter Value Unit
Molding temperature 170–190 °C
Transfer pressure 40–90 kg/cm³
Transfer time 10–25 sec
Cure time at 175 °C 1.5–2 min
Post mold cure time at 175 °C 6-12 h
Post mold cure time at 190 °C 4-6 h

To achieve the best results, test the recommended conditions on the mold. Users should conduct their own testing to ensure it meets their specific needs and application.

Processing Instructions

  • Before use, let LINQSOL EMC-1533 reach room temperature for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination. 
  • Use the materials within 72 hours after removing the container from cold storage.

Storage and Handling

LINQSOL EMC-1533 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life at 5 °C is 183 days. 

 

 

 

Recently viewed products

Leading Brands Trust in Our Products and Services

Products that Perform | Knowledge that Serves | Service that Delivers