LINQSOL EMC-9023 | Epoxy Mold Underfill
Harmonization Code : 3907300090 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms
Main features
- Green epoxy molding compound
- Epoxy mold undefill
- Designed for FCBGA, FCCSP, SiP
Product Description
LINQSOL EMC-9023 series is a molded underfill (MUF) epoxy molding compound specifically developed for the encapsulation of flip chip ball grid arrays (FCBGA), flip chip chip scale packages (FCCSP), and system in packages (SiP). LINQSOL EMC-9023 has excellent flowability and low modulus that meets low-stress requirements. Additionally, with a UL 94 V-0 flammability rating and low ionic contents.
EMC-9023 guarantees good moldability and outstanding reliability performance. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, LINQSOL EMC-9023 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.
Available Version
- EMC-9023 Standard
- EMC-9023K (Improved moisture resistance)
- EMC-9023E (Low-stress epoxy mold underfill)
EMC-9023
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS_LINQSOL EMC-9023 Series
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
Curing Conditions
Additional Information
LINQSOL EMC-9023 Epoxy Mold Underfill Series
To simplify die-to-substrate connection and multilayer substrate or laminate, epoxy mold underfill is essential- combining underfill and over-molding the packages into one.
| Property | Unit | EMC-9023 | EMC-9023K | EMC-9023E |
|---|---|---|---|---|
| General Properties | ||||
| Filler content | % | 85 | 85 | 85 |
| Filler sieving size | µm | 20 | 20 | 20 |
| Specific gravity | - | 1.96 | 1.96 | 1.96 |
| Spiral flow at 175°C | cm | 180 | 165 | 190 |
| Chemical Properties | ||||
| Ion content - Chloride (Cl–) | ppm | 7 | 3 | 7 |
| Ion content - Sodium (Na+) | ppm | 6 | 5 | 4 |
| Water absorption (PCT 24hr) | % | 0.38 | 0.3 | 0.35 |
| pH of extract | - | 5.0 | 6.0 | 5.0 |
| Electrical conductivity of extract | µS⋅cm–1 | 40 | 15 | 30 |
| Mechanical Properties | ||||
| Flexural strength (25°C / 260°C) | MPa | 150 / 25 | 145/23 | 145 / 21 |
| Flexural modulus (25°C / 260°C) | GPa | 23.6 / 11 | 21/0.9 | 23.6 / 9.8 |
| Mold shrinkage | % | 0.24 | 0.23 | 0.27 |
| Thermal Properties | ||||
| Glass transition temperature | °C | 162 | 150 | 150 |
| Coefficient of thermal expansion, α1 | ppm/°C | 13 | 11 | 11 |
| Coefficient of thermal expansion, α2 | ppm/°C | 47 | 46 | 43 |
| Gel time at 175°C | sec | 60 | 52 | 56 |
| Flammability | UL-94 | V-0 | V-0 | V-0 |
LINQSOL EMC-9023K Adhesion on Cu/Ag Substrate through Tab Pull Test
| Property | Unit | EMC-9023K |
|---|---|---|
| Adhesion to Cu after Post-Mold Cure | MPA | 5 |
| Adhesion to Ag after Post-Mold Cure | MPA | 6 |
| Adhesion to Cu after MSL 3 Pre-conditioning | MPA | 4 |
| Adhesion to Ag after MSL 3 Pre-conditioning | MPA | 6 |
Processing Instructions
-
Before use, let LINQSOL EMC-9023 compounds reach room temperature (23±5 °C) for 16 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
-
Use the materials within 24 hours after removing the container from cold storage.
Storage and Handling
LINQSOL EMC-9023 series is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5°C is 183 days.
Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.
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