LINQSOL EMC-G833 | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Green epoxy molding compound
- Designed for Quad Flat No Leads(QFN), Quad Flat (QFP) packages and DFN Packages
- Excellent reliability performance
Product Description
LINQSOL EMC-G833 is a green epoxy molding compound specifically developed for the encapsulation of Quad Flat No Leads(QFN), Quad Flat (QFP) packages and other surface mount packages. Its wide gel time provides a better processing window, required for QFN, DFN nd QFP molding.
LINQSOL EMC-G833 has a high spiral flow that meets higher flowability requirements. Additionally, with a UL 94 V-0 flammability rating and ultra-low water absorption, EMC-G833 guarantees excellent performance and outstanding reliability. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH.
Overall, LINQSOL EMC-G833 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.
Available Variants
- LINQSOL EMC-G833 Standard Epoxy Mold compound for MSL 3 QFN, DFN and QFP.
- LINQSOL EMC-G833R MSL 1 Capable
Reliability Tests Passed:
- Preconditioning: 30°C, 60% RH
- u-HAST: T=130°C, RH= 85%, P= 230kPa
- PCT, Tₐ=121°C, P=205 kPa, RH=100%* 168 hours
- TCT, –65 to 150 °C * 1000 cycles
- HTST, T=150°C * 1000 hours
EMC-G833
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeksPackaging
TDS, SDS & Technical Documents
- TDS_LINQSOL EMC-G833
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Curing Conditions
Additional Information
| PROPERTY | UNIT | EMC-G833 | EMC-G833R |
|
Color |
– |
Black |
Black |
|
Filler content |
% |
87 |
88 |
|
Filler cut size |
µm |
75 |
75 |
|
Specific gravity |
– |
1.97 |
2.0 |
|
Spiral flow at 175 °C |
cm |
165 |
150 |
|
Ion content Chloride (Cl–) concentration Sodium (Na+) concentration |
ppm |
6 |
5 5 |
|
Electrical conductivity of extract |
µS⋅cm–1 |
50 |
30 |
|
Flexural strength |
MPa |
145 |
162 |
|
Flexural modulus |
GPa |
22.8 |
24 |
|
Glass transition temperature |
°C |
112 |
118 |
|
Coefficient of thermal expansion, α1 |
ppm/K |
11 |
10 |
|
Coefficient of thermal expansion, α2 |
ppm/K |
36 |
36 |
|
Gel time at 175 °C |
sec |
57 |
52 |
|
Flammability |
UL-94 |
V-0 |
V-0 |
LINQSOL EMC-G833 Storage and Handling
LINQSOL EMC-G833 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days.
Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.
