EMC-G845 | Black Epoxy Molding Compound

LINQSOL EMC-G845 is a halogen-free epoxy molding compound that reliably encapsulates various semiconductor devices. EMC-G845 is particularly well-suited for thin, high-density packages like Quad Flat No-Leads (QFN) and Quad Flat (QFP). This advanced compound combines superior processing characteristics with robust performance and strict safety compliance, offering a comprehensive solution for your encapsulation needs.

Product Key Features

• Optimized Flowability — Has broad gel time and high spiral flow, allowing a wide processing window for efficient molding of complex packages.
• Low Water Absorption — Ensures outstanding reliability and long-term performance of encapsulated semiconductor devices.
• RoHS and REACH Compliant

Applications

• Encapsulation of quad flat no-leads (QFN) & quad flat (QFP) packages.
• Also suitable for a variety of other semiconductor packages requiring precise and robust encapsulation.