EO-830MT | One-part Epoxy Adhesive for Metal Bonding
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- High crack & fatigue resistance
- Excellent adhesion on metals
- RoHS compliant
Product Description
LINQBOND EO-830MT is a single-component, thermosetting epoxy adhesive formulated for robust structural bonding of metallic substrates to disparate materials, including ceramics and glass fibers. EO-830MT exhibits superior resistance to crack propagation and fatigue, coupled with high cohesive strength and tensile shear adhesion. Its material properties make it suitable for applications requiring exceptional long-term reliability and operational durability.
LINQBOND EO-830MT is characterized by an extended ambient temperature working life and achieves optimal cross-linking via thermal curing at temperatures exceeding 120 °C. It also demonstrates a high thixotropic index, providing excellent sag resistance during application and post-dispense fixturing. Furthermore, this product is compliant with major environmental directives, including the RoHS 2011/65/EU Directive.
Product Applications
-
Bonding of metals to ceramics, glass fibers, and composite materials
EO-830MT
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeksPackaging
TDS, SDS & Technical Documents
- TDS_LINQBOND EO-830MT
Technical Specifications
General Properties
Physical Properties
Additional Information
Directions for Use
-
Make sure that the substrate is clean and free of contaminants, such as dirt, grease, or mold release agents. A simple solvent wipe is often sufficient.
-
Before use, allow the sealed container to equilibrate to room temperature (14–34 °C) for 1–2 hours.
-
Cure time will depend on actual production parts and equipment such as part geometry, materials, bondline thickness and the oven temperature.
-
Curing profiles should be considered carefully in specific application to avoid extreme heat release and consider gradually cooling to minimize the thermal stress.
-
For maximum bonding strength and properties, apply the adhesive evenly to one or both surfaces to be joined, increase the curing temperature or prolong the curing time.
Recently viewed products
TMC-8020LS | Clear Optical Molding Compound
- LED Encapsulation
- Low stress
- Better reflow and Thermal shock
TG 4000 | Thermal Grease
- 0.005 Thermal Impedance
- 4.0 Thermal Conductivity
- 23μm BLT
LOCTITE SF 7387
- Activator
- Very low viscosity
- Promote cure of acrylic adhesives
FM-DA26 | Reactive PDMS - Monoterminal Hydroxy (Diol)
- Mono terminal
- 15,000 g/mol | 500 mPas
- Hydroxy (Diol) functional group
PIT1S-B | 1-mil Black Polyimide (Kapton) tape with Silicone Adhesive
- 1 mil polyimide Film
- Opaque black color through the film
- 3000V Breakdown Voltage
