LOCTITE ECCOBOND FP0087
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High Tg
- Excellent moisture resistance
- Excellent thermal shock resistance
Product Description
LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress-sensitive devices. It yields best results when used to encapsulate a device enclosed in a cavity or potting ring, which restricts the flow of the material. This material is a great encapsulant for potting stress-sensitive devices.
LOCTITE ECCOBOND FP0087 is a single component potting product with low thermal expansion. This product therefore provides excellent thermal shock resistance and reduced warpage and cracking. The unique combination of low stress and excellent resistance to moisture and process fluids provide excellent results in severe automotive environments.
Cure Schedule
- 1 hour @ 125°C plus 1 hour @ 180°C
FP0087
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 50 daysPackaging
TDS, SDS & Technical Documents
- ECCOBOND FP0087-EN
- 498413_MSDS_UT_US_EN
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Recently viewed products
HLP 2000 | Two part Thermal potting material
- Low Viscosity
- 2.0 Thermal Conductivity
- Room temperature cure
LOCTITE ECCOBOND FP4526
- Low viscosity
- Excellent wettability
- Hi-Pb and Pb-free applications
LOCTITE ECCOBOND FP4655
- Low stress
- Fine particle filler
- Combine with FP4451
Hysol GR2710 | Gold Epoxy Mold Compound
- For conductive polymer and AO capacitors
- Excellent thin wall crack resistance
- Fast cure for automold equipment
