LOCTITE ECCOBOND FP4323
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Thixotropic
- Low CTE
- High purity
Product Description
LOCTITE ECCOBOND FP4323 liquid epoxy encapsulant glob top is designed with flow capabilities that allows encapsulation without flowing beyond the chip. Among its other benefits, it provides excellent moisture and chemical resistance.
LOCTITE ECCOBOND FP4323 is a thixotropic, high purity encapsulant with low CTE for improved thermal cycling. It is typically used for chip on board and plastic PGA applcations.
Cure Schedule
- 4 hours @ 150°C or
- 1 hour @ 170°C or
- 2 hours @ 125°C + 4 hours @ 150°C
FP4323
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 70 days
Shipping in 12 weeks
Shipping in 70 daysPackaging
TDS, SDS & Technical Documents
- ECCOBOND FP4323-EN
- 467120_MSDS_UT_US_EN
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
Additional Information
No available data for Dielectric strength. According to our scientists a highly silica filled encapsulant will have a range of 20 to 40Kv/mm.
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