LOCTITE ECCOBOND FP4530
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Fast flow
- Small gap sizes
- Snap cure
Product Description
LOCTITE® ECCOBOND FP4530 underfill is designed for flip chip on flex applications with a 25micron gap. Upon cure, the material color will change from blue to green.
LOCTITE® ECCOBOND FP4530 is a snap curable epoxy underfill with 50% filler weight that flows fast and is compatible with small gap sizes.
Cure Schedule
- 7 minutes @ 160°C (Snap Cure)
- Substrate Temperature, °C 90
FP4530
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Product availability 
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TDS, SDS & Technical Documents
- LOCTITE ECCOBOND FP4530
- LOCTITE ECCOBOND FP4530 US SDS
Technical Specifications
General Properties
Pot Life Pot Life
24 hours Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
145 °C Physical Properties
Viscosity Viscosity
3,500 mPa.s 
