LOCTITE ECCOBOND FP4650
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Excellent chemical resistance
- Low thermal expansion
- High purity
Product Description
LOCTITE ECCOBOND FP4650 epoxy encapsulant features very low thermal expansion while retaining syringe dispense capabilities. It is a heat curable fill encapsulant with high purity and a filler content of 83%. The maximum filler size is 120um while the average filler size is 10um. For fine wire pitch applications you can also look into FP4651 with much lower particle filler size.
Recommended Cure Schedule
- 1 hour @ 120°C plus 2 hours @ 160°C
- 3 hours @ 170°C
FP4650
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 128 days
Shipping in 12 weeks
Shipping in 12 weeksPackaging
TDS, SDS & Technical Documents
- 498838_MSDS_UT_US_EN
- ECCOBOND FP4650-EN
Technical Specifications
General Properties
Thermal Properties
Physical Properties
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