LOCTITE ABLESTIK FS 849-TI
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Low outgassing
- Low electrical resistance
- High thermal conductivity - 7.8 W/mK
Product Description
LOCTITE ABLESTIK FS 849-TI is a proprietary hybrid chemistry adhesive designed specifically for power applications. It features high thermal conductivity, low electrical resistance, medium modulus, and low outgassing, making it an excellent choice for die-attach applications in high-reliability packages.
Its silver-based filler type enhances both thermal and electrical performance. This medium modulus adhesive is optimized for a wide variety of die sizes, maintaining thermal and electrical conductivity under demanding operating conditions. Its thermal conductivity is significantly high for die attach applications with 7.8 W/mK.
Cure schedule
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15 minute ramp to 175°C + 30 minutes @ 175°C in N2
FS849TI
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TDS, SDS & Technical Documents
- TDS LOCTITE ABLESTIK FS 849-TI issue 08-12
- MSDS LOCTITE ABLESTIK FS 849-TI issue 06-23 (US)
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
Additional Information
DIRECTIONS FOR USE
1. Thawed material should immediately be placed on dispense equipment for use.
2. If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive.
3. Adhesive must be completely used within the product's recommended work life.
4. Silver-resin separation may occur if the adhesive is left out at room temperature, beyond the recommended work life.
5. Apply enough adhesive to achieve a 25 to 50 μm wet bondline thickness, dispensed with approximately 25 to 50 % filleting on all sides of the die.
6. Alternate dispense amounts may be used depending on the application requirements.
7. Star or crossed-shaped dispense patterns will yield fewer bondline voids than the matrix style of dispense pattern.
