Hysol GR2330 | Orange Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

GR2330 Orange Epoxy Mold CompoundHysol GR2330 | Orange Epoxy Mold Compound

Main features

  • For MnO Tantalum Capacitors
  • Orange Colored
  • Orange version of GR2310 and GR2320

Product Description

Hysol GR2330 is an orange semiconductor epoxy molding compound designed for the encapsulation and protection of Manganese Oxide or MnO2 tantalum capacitors and other automotive packages. Once molded and post-mold cured, this product provides optimum protection and reliability for these capacitor devices.

Hysol GR2330 is a laser markable environmentally "green" product, that doesn't contain any halogens including bromine, antimony or phosphorus flame retardants. Hysol's MG-series epoxy molding compounds dominated the space for tantalum capacitors but used halogen-containing flame retardants. This next generation epoxy mold compound replaces these older generation products. This material is designed to achieve JEDEC Level 1 requirements at 260°C reflow temperature on Maganese Oxide MnO2 capacitors. Its fast cure time also ensures that it is compatible with the latest automold manufacturing equipment. Hysol GR2330 meets UL 94 V-0 Flammability at 1/4 inch (6.35mm) thickness.

Product Family

GR2330 Orange

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Packaging
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TDS, SDS & Technical Documents
  • Hysol GR2330
    English (Technical Data Sheet (TDS))
  • SDS Hysol_GR 2330_EU_EN_2023
    English (Safety Data Sheet (SDS))
  • CAPLINQEpoxyMoldCompoundHandlingGuide1
    English (Technical documents)

Technical Specifications

General Properties
Color Color
Orange
Filler Content Filler Content
74 %
Specific Gravity Specific Gravity
1.83
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
175 °C
Thermal Conductivity Thermal Conductivity
0.65 W/m.K
UL 94 Rating UL 94 Rating
V0
Electrical Properties
Volume Resistivity Volume Resistivity
300000000000000000 Ohms⋅cm
Chemical Properties
Moisture absorption Moisture absorption
0.45 %
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
81 cm
Mechanical Properties
Molded Shrinkage Molded Shrinkage
0.17 %
Curing Conditions
Transfer Pressure Transfer Pressure
40 - 85 kg/cm2
Transfer Time Transfer Time
6 - 15 s

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