Hysol GR60 | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Designed for IPM application
- Good moisture resistance
- High thermal conductivity
Product Description
Hysol GR60 Series is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of intelligent powder module (IPM) applications. With excellent workability and reliability, GR60 series is suitable for long wire or large body devices. With high thermal conductivity (1.7 ~ 2.2 W/mk), GR60 could be applied in SiC IGBT module with Tj 175°C and 1200V. More thermal conductive versions are also under development. Hysol GR60 is an environmentally "green" product, meaning that it doesn't contain any halogens including bromine, antimony or phosphorus flame retardants. Hysol GR60 meets UL 94 V-0 Flammability at 1/8 inch thickness. Key features are summarized as:
Reliability (check GR60 HT beta-site tests)
- High adhesion to Cu/Ag/Ni
- Low stress and low water absorption
- High thermal conductivity
- Excellent performance in HAST, HTRB, TC, PCT, HTS, etc.
Moldability
- Excellent workability with wide process window
- No wire sweep
- Good warpage control
Available versions: GR60 HT, GR60 PT (check the GR60 comparison)
Suitable Package: Full pack type IPM, substrate type IPM
GR60
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS_GR60HT-LDS-EN-Oct-2017
- TDS_GR 60PT_3000053_Oct-2022
- TDS_GR 60PT_2288148_Jun-2021
- TDS_GR 60_3000024_Dec-2021
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Additional Information
| Property | GR60PT(98D69B) | GR60PT(102A11) | GR60HT | GR60 (M1) |
| Filler content | 83 | 86 | 86 | 87 |
| Epoxy | EOCN+LWA1 | EOCN+LSR | EOCN/LWA2 | MAR+LWA2 |
| Gel Time (sec) | 32 | 30 | 40 | 30 |
| Spiral Flow (inch) | 40 | 29 | 24 | 60 |
| Tg (°C) | 172 | 117 | 119 | 107 |
| CTE 1 | 20 | 15 | 19 | 8 |
| CTE 2 | 61 | 49 | 44 | 29 |
| Flexural Strength/Modulus, Mpa | 116/ 17925 | 110/ 21112 | 137/ 19625 | 145/ 22580 |
| DMA-Flexural Modulus (RT) | 21141 | 25377 | - | 26971 |
| DMA-Flexural Modulus (175/260°C) | 2377/795 | 613/453 | - | 888/ 647 |
| PCT 24hrs wt% | 0.45 | 0.22 | 0.20 | 0.34 |
| CI-, ppm | 34 | 18 | 9 | 9 |
| Na+, ppm | 5 | 3 | 8 | 4 |
| pH, ppm | 7 | 7 | 6 | 5 |
| Volume Resistivity, 10E15 Q | 2 | 7 | 4.09 | 83 |
| Thermal Conductivity, W/m.K | 1.9 | 1.8 | 2.2 | 0.9 |
Epoxy Molding Compound For IPM Application
Hysol has developed different series (GR60 series, GR600 series, GR750 series, etc.) for IPM application. Highly conductive versions are also in development.
Beside the common features, the two version GR60 PT and GR60 HT have their own unique features to meet niche requirements for your module. The differences between GR60 PT and GR60 HT:
- Thermal conductivity: 1.7 W/mK (GR60 PT) v.s. 2.2 W/mK (GR60 HT)
- Good adhesion to: Cu & Au surface (GR60 PT) v.s. Cu & Au & Ni surface (GR60 HT)
- Others: high cost-efficient (GR60 PT) and good moisture resistance (GR60 HT)
Hysol GR60 series products are highly thermal conductive molding compounds designed for IPM applications. Both GR60 HT and GR60 PT are dedicated to module package with excellent workability and reliability, suitable for long wire or large body device. The key common features of GR60HT and GR60PT are:
Workability
- No wire sweep
- Warpage control
- Wide molding window
Great peformance
- Good electrical stability during tests
- High thermal conductivity
- Flammability rating UL94 V-0 @1/8 inch
GR60 HT Beta-Site Customer Evaluation
GR60 HT Release Force
