Hysol GR700 | Black Epoxy Mold Compound

Hysol GR700, is a halogen free, black, silica filled (87% filler weight) semiconductor grade green epoxy molding compound designed for SOP MSL1. This low stress, high adhesion compound has very good electrical performance and is a proven, commercially available product code. This is a product that has achieved MSL 1 and its comparative tracking index (CTI) is 600V.

Hysol GR700 is a technologically advanced, halogen free, green epoxy molding compound with excellent electrical performance, designed for high power devices applications with low moisture absorption requirements. Typical use can be in SOP, DPAK,QFP, QFN, SOT semiconductor packages. Furthermore, it meets UL 94 V-0 flammability at 1/8 inch thickness..

HYSOL GR700 has been formulated to provide the best possible moldability and as wide a molding latitude as possible. Although molding and curing conditions will vary from situation to situation.

Available versions:

• GR700 (STD)
• GR 700 C3D
• GR700 C4C
• GR700 P2