Hysol GR710F | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Halogen free
- Low moisture absorption
- High reliability
Product Description
Hysol GR710F is a halogen free, black, spherical silica filled (75um cut size) semiconductor grade epoxy molding compound. It has high adhesion, low moisture absoprtion (0.2%) and a Tg of ~115°C.
Hysol GR710F is a technologically advanced, halogen free epoxy molding compound with good electrical performance, designed for high reliability applications with low moisture absorption requirements. Typical packages can be T0, SOIC16, TSOP and SSOP packages. It delivers outstanding performance and ease of use and it meets UL 94 V-0 flammability at 1/8 inch thickness. This product is a substitute for Hysol GR825-73B.
Available Version:
GR710F
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TDS, SDS & Technical Documents
- GR510 GR700 GR710 GR920 Product Introduction
Technical Specifications
General Properties
Electrical Properties
Chemical Properties
Thermal Properties
Curing Conditions
Physical Properties
Additional Information
GR710F Series Property Comparison
| Item | Unit | GR710F | GR710F GN | GR710F GN26 |
|---|---|---|---|---|
| Epoxy resin | MAR+LMW | MAR+LMW | MAR+LMW | |
| Filler content | % | 89 | 88 | 87 |
| Filler type | Spherical | Spherical | Spherical | |
| Filler cut size | µm | 75 | 75 | 75 |
| Gel time (175°C) | s | 30 | 30 | 31 |
| Spiral flow (175°C) | inch | 42 | 50 | 38 |
| Tg by TMA | °C | 115 | 112 | - |
| CTE 1 (TMA) | ppm/°C | 9 | 9 | - |
| CTE 2 (TMA) | ppm/°C | 37 | 34 | - |
| Modulus at RT (DMA) | MPa | 28176 | 26451 | 26557 |
| Modulus at 175°C (DMA) | MPa | 752 | 620 | 523 |
| Modulus at 260°C (DMA) | MPa | 637 | 541 | 440 |
| Moisture absorption (PCT 24 hrs) | % | 0.20 | 0.25 | 0.25 |
| Flexural strength at 25°C | MPa | 150 | 140 | 142 |
| Flexural modulus at 25°C | MPa | 24489 | 23003 | 24300 |
| Flammability (UL94, 1/8") | Rating | V-0 | V-0 | V-0 |
| Volume resistivity | ×10¹⁵ Ω·cm | 65 | 70 | 50 |
| Comparative Tracking Index (CTI) | V | 575 | 600 | 575 |
Data contained herein may vary and are intended for reference only. Please refer to Technical Data Sheets for accurate values.
This table summarizes key processing, mechanical, thermal, and electrical properties for the HYSOL GR710F epoxy molding compound family (GR710F, GR710F GN, and GR710F GN26).
GR710F, GR710F GN, and GR710F GN26 share the same MAR+LMW epoxy system, spherical filler with a 75 µm cut, and UL94 V-0 flammability, but they differentiate in flow and stiffness retention, which drives where each grade fits best in molding. GR710F GN is the highest flow option at 175°C (50 in) while retaining strong mechanical performance (DMA modulus 26451 MPa at RT, 620 MPa at 175°C) and the highest electrical robustness in this set (volume resistivity 70 ×10^15 Ω·cm, CTI 600 V), making it the best default for complex mold filling or longer flow length designs where you still want stronger dielectric margin. GR710F is the stiffest overall (highest DMA modulus at RT and at temperature, and higher Tg and slightly higher CTE2 than GN), which generally favors packages where dimensional stability and warpage control are priority and the required flow length is moderate (spiral flow 42 in). GR710F GN26 trades flow (38 in) and high temperature modulus (lowest modulus at 175°C and 260°C) for the lowest filler content, which can be a practical choice when reduced compound stiffness helps relieve stress in more fragile packages or layouts sensitive to stress transfer, but it comes with lower electrical resistivity than GN and is less suited when maximum flow or dielectric margin is the primary requirement.
