Hysol GR750 X2 | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Low moisture absorption
- High Tg: 182°C
- For high temperature applications
Product Description
Hysol GR750 X2 is a halogen free, black, silica filled (75um cut size) semiconductor grade epoxy molding compound. It has good pull tab adhesion on Copper (429 N) and very High Tg (182 °C). The entire GR75XX product line is alterations to the same formulation to fit everybody's needs and X2 leans towards High Tg. It has achieved MSL 3 but we haven't been able to achieve MSL 1, yet. The product is still in active development so some properties might end up higher or lower depending on the state of the final formulation. Its comparative tracking index (CTI) is 600V.
Hysol GR750 X2 is a technologically advanced, non anhydride, green epoxy molding compound with excellent electrical performance, designed for high power devices especially for high temperature application with low moisture absorption requirements. Typical packages can be TO220, ZIP, PentaWatts, Heptawatts and TDA series packages. It delivers outstanding performance and ease of use and it meets UL 94 V-0 flammability at 1/8 inch thickness.
GR750X2
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TDS, SDS & Technical Documents
- HYSOL GR750 X2 20201011 (1)
- CAPLINQEpoxyMoldCompoundHandlingGuide1
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Curing Conditions
Additional Information
Comparison of the entire GR7XXX product series
|
Product Name |
MG15F-MOD2 |
MG15F-0140 |
GR750 (Std) |
GR750 X1 (Std) |
GR750X1 |
GR720X2 (Std) |
GR750 X2FF |
GR720X2 (high CTE) |
||
|---|---|---|---|---|---|---|---|---|---|---|
|
Epoxy type |
- |
OCN/BisA/DCPD |
OCN/BisA |
MFN |
MFN/L.W.A. |
MFN/L.W.A. |
MFN/L.W.A. |
MAR |
MAR/L.Vis. |
|
|
Hardener type |
- |
Anhydride |
Anhydride |
New |
New |
New |
New |
New |
New |
|
|
Filler cut size |
µm |
106 |
150 |
75 |
75 |
75 |
75 |
45 |
75 |
|
|
Flammability |
UL-94 |
V-0 at ¼” |
V-0 at 1/8'' |
V-0 at 1/8'' |
V-0 at 1/8'' |
V-0 at 1/8'' |
V-0 at 1/8'' |
V-0 at 1/8'' |
V-0 at 1/8'' |
|
|
Spiral Flow |
inches |
36 |
20 |
42 |
36 |
26 |
45 |
40 |
41 |
|
|
Gel Time |
sec |
32 |
17 |
26 |
24 |
29 |
30 |
30 |
35 |
|
|
Viscosity @ 175°C |
PaS |
20 |
28 |
10 |
13 |
43 |
25 |
20 |
15 |
|
|
Tg by TMA |
oC |
242 |
195 |
225 |
202 |
197 |
170 |
182 |
170 |
|
|
CTE 1 |
ppm/°C |
16 |
21 |
10 |
8 |
6 |
9 |
9 |
14 |
|
|
CTE 2 |
ppm/°C |
49 |
70 |
40 |
42 |
31 |
35 |
32 |
40 |
|
|
DMA Storage Modulus at RT |
MPa |
18246 |
14078 |
20560 |
23155 |
29241 |
21631 |
23391 |
20971 |
|
|
DMA Storage Modulus at 260C |
MPa |
6491 |
1883 |
1658 |
1713 |
1711 |
907 |
1007 |
961 |
|
|
Tg by DMA Tanδ Peak |
0C |
270 |
217 |
235 |
207 |
200 |
177 |
182 |
177 |
|
|
Flexural modulus |
Mpa |
16312 |
12449 |
16880 |
18042 |
21469 |
17470 |
17549 |
16900 |
|
|
Flexural strength |
Mpa |
120 |
126 |
138 |
136 |
134 |
152 |
169 |
150 |
|
|
Moisture absorption PCT24h |
% |
0.55 |
0.65 |
0.35 |
0.3 |
0.2 |
0.2 |
0.2 |
0.2 |
|
|
Cl-/ Na+ |
ppm |
<10 |
<10 |
<15 |
<15 |
<15 |
<15 |
<15 |
<15 |
|
|
PH |
|
4~6 |
4~6 |
5~7 |
5~7 |
5~7 |
5~7 |
5~7 |
5~7 |
|
|
Volume resistivity @21C & 500V |
Ω.cm |
2.4E+16 |
6.3E+16 |
3.3E+16 |
1.7E+16 |
1.0E+16 |
1.6E+16 |
1.8E+16 |
1.0E+16 |
|
|
Dielectric constant, 21 C & 1MHz |
|
3.6 |
3.7 |
3.7 |
3.7 |
3.7 |
3.8 |
3.8 |
3.9 |
|
|
Adhesion (tabpull) after MSL3 |
on Cu |
N |
344 |
136 |
365 |
406 |
307 |
360 |
407 |
331 |
|
on Ag |
N |
235 |
NA |
345 |
363 |
269 |
234 |
348 |
415 |
|
|
on Ni |
N |
84 |
111 |
170 |
194 |
130 |
104 |
102 |
110 |
|
|
Comparative Tracking Index |
V |
600 |
400 |
600 |
600 |
600 |
600 |
600 |
600 |
|
|
Recommended Molding condition |
190°C110s |
180°C100s |
180°C 90s |
180°C 90s |
180°C 90s |
180°C 90s |
180°C 90s |
180°C 90s |
||
|
Recommended PMC condition |
190°C 3~6hrs |
190°C 3~6hrs |
190°C10hrs |
190°C10hrs |
190°C10hrs |
190°C10hrs |
190°C10hrs |
190°C10hrs |
||
GR750 X2FF Viscosity curve
DETA Data for the GR7XX product line
DMA and TMA curves for GR750 - X2
Epoxy molding compounds for High power Sic devices.
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