Hysol GR920 | Epoxy mold underfill
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Molding underfill
- Excellent narrow gap fill
- Outstanding warpage control
Product Description
Hysol GR920 is a molding underfill product series. This product is not formulated with low-alpha silica but we could develop a low alpha version, suitable for memory chips, if needed.
Hysol GR920 is based on a MAR/LMW chemistry with an MF/MAR hardener and an MH flame retardant. Molding underfills are typically used for BGA, flip chip applications.
Features
- Good reliability performance on advanced packaging
- Excellent narrow space filling.
- Meet MSL3~MSL2/260C requirement.
- Outstanding warpage control(unit warpage<80 μm ).
- Meet UL94 V-0 flammability rate at 1/8 inch thickness.
Available Version
- Hysol GR920 H
- Hysol GR920 Q
- Hysol GR920 M
- Hysol GR920 L
- Hysol GR920 A
GR920
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2. Select Pellet Size
3. Select Pellet Weight
4. Select Package Size
Catalog Product
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Product availability 
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Please select Product Form, Pellet Size, Pellet Weight and Package Size before adding your product to your cart.
TDS, SDS & Technical Documents
- Hysol Huawei EMC introduction (1)
- GR510 GR700 GR710 GR920 Product Introduction
- GR920 Series for FCCSP FCBGA FCLGA
Technical Specifications
General Properties
Density (g) Density (g)
2 g/cm3 Filler Content Filler Content
88,5 % Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
102 cm Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
120 °C Thermal Conductivity Thermal Conductivity
0.9 W/m.K Mechanical Properties
Molded Shrinkage Molded Shrinkage
0,17 % Additional Information
GR920 Series Products Properties Comparison
| Property / Product | Unit | Hysol GR920 H | Hysol GR920 Q | Hysol GR920 M | Hysol GR920 L | Hysol GR920 A |
|---|---|---|---|---|---|---|
| UNCURED PROPERTIES | ||||||
| Packages | - | FCLGA | FCCSP/FCLGA | FCCSP | FCBGA | FCCSP |
| Filler cut | µm | 20 | 20 | 20 | 20 | 20 |
| Filler content | % | 84 | 85 | 88.5 | 88 | 87.5 |
| Filler Type | Spherical | Spherical | Spherical | Spherical | Spherical | |
| Hot Plate Gel time, @ 175°C | s | 38 | 39 | 37 | 34 | 46 |
| Spiral Flow @ 175°C | inch | 60 | 56 | 39 | 36 | 66 |
| Halogen-free (Green) | ✔ | ✔ | ✔ | ✔ | ✔ | |
| TYPICAL CURED PROPERTIES | ||||||
| Glass Transition Temperature | °C | 102 | 138 | 120 | 158 | 150 |
| Coefficient of Thermal Expansion (CTE) α1, TMA | ppm/°C | 13 | 12 | 10 | 9 | 9 |
| Coefficient of Thermal Expansion (CTE) α2, TMA | ppm/°C | 45 | 45 | 35 | 33 | 34 |
| Flexural Strength @25°C | MPa | 125 | 146 | 120 | 154 | 138 |
| Flexural Modulus @25°C | MPa | 13500 | 15500 | 19500 | 17800 | 21000 |
| Water Absorption, 24hr PCT | % | 0.4 | 0.35 | 0.3 | 0.3 | 0.38 |
| Mold Shrinkage after PMC | % | 0.36 | 0.26 | 0.13 | 0.20 | 0.19 |
| Specific Gravity | - | 1.93 | 1.96 | 1.99 | 1.99 | 1.98 |
| Cl Content | ppm | 7 | 7 | 8 | 7 | 9 |
| pH | - | 4.5 | 5.1 | 6.5 | 6.1 | 6.3 |
| Moisture Sensitivity Level | - | 2 | 3 | 3 | 3 | 3 |
| Feature | - |
Good Flowability Low Modulus |
Good Flowability Low Modulus Medium Tg |
Low Modulus Low Shrinkage Low CTE |
High Tg Low Shrinkage Low CTE |
Good Flowability High Tg Low Shrinkage Low CTE |
Beta Site Performance in HT**
| Property / Product | Unit | Commercial | Hysol GR910 L20 |
|---|---|---|---|
| UNCURED PROPERTIES | |||
| Epoxy Type | - | MAR/MF | |
| Hardener Type | - | MAR/MF | |
| Filler cut | µm | 20 | 20 |
| Filler content | % | 88 | 88 |
| Hot Plate Gel time, @ 175°C | s | 30 | 34 |
| Spiral Flow @ 175°C | cm | 99 | 91 |
| TYPICAL CURED PROPERTIES | |||
| Glass Transition Temperature, TMA | °C | 142 | 158 |
| Glass Transition Temperature, DMA | °C | 150 | 156 |
| Coefficient of Thermal Expansion (CTE) α1, TMA | ppm/°C | 9 | 9 |
| Coefficient of Thermal Expansion (CTE) α2, TMA | ppm/°C | 37 | 33 |
| Flexural Strength @25°C | MPa | 175 | 154 |
| Flexural Modulus @25°C | MPa | 19500 | 17800 |
| Storage Modulus by DMA @25°C | Mpa | 25000 | 25914 |
| Storage Modulus by DMA @175°C | Mpa | 3000 | 2119 |
| Storage Modulus by DMA @260°C | Mpa | 1200 | 1203 |
| Water Absorption, 24hr PCT | % | 0.38 | 0.37 |
| Mold Shrinkage after PMC | % | 0.18 | 0.20 |
| Hardness | Shore D | 83 | 81 |
| Package | Mold Cap | Strip Size | Package Size | Die Size | Bump Height |
|---|---|---|---|---|---|
| FCCSP | 0.4 mm | 240.5 * 95 * 0.22 mm | 5.4 * 5.4 mm | 3.3 * 2.8 * 0.15 mm | 65 µm |
| Item | Hysol GR910 L20 |
|---|---|
| Appearance |  |
| C-Scan |  |
| T-Scan |  |
| Bump-Scan |  |
| Warpage |
Short Side 2.07 mm Long Side 2.11 mm |
| Marking | OK |
| Test Item | Qualification Test Condition | Test Results | Test Criterion | SAT |
|---|---|---|---|---|
| Before Test | / | Pass | NA |  |
| Pre-conditioning |
Moisture Soak: 30°C/60%RH, 192 hours Reflow @ 260°C * 3times |
Pass | J-STD-020E |  |
| uHAST |
130°C, 85%RH 33.3 psia, unbiased 192 hours |
Pass | JESD22-A118B |  |
| TCB | -55°C~125°C, 1000 cycles | Pass | JESD22-A104E |  |
Beta Site Performance in JT**
| Property / Product | Unit | Commercial | Hysol GR910 L20 |
|---|---|---|---|
| UNCURED PROPERTIES | |||
| Epoxy Type | - | MAR/MF | |
| Hardener Type | - | MAR/MF | |
| Filler cut | µm | 20 | 20 |
| Filler content | % | 88 | 88 |
| Hot Plate Gel time, @ 175°C | s | 30 | 34 |
| Spiral Flow @ 175°C | cm | 99 | 91 |
| TYPICAL CURED PROPERTIES | |||
| Glass Transition Temperature, TMA | °C | 142 | 158 |
| Glass Transition Temperature, DMA | °C | 150 | 156 |
| Coefficient of Thermal Expansion (CTE) α1, TMA | ppm/°C | 9 | 9 |
| Coefficient of Thermal Expansion (CTE) α2, TMA | ppm/°C | 37 | 33 |
| Flexural Strength @25°C | MPa | 175 | 154 |
| Flexural Modulus @25°C | MPa | 19500 | 17800 |
| Storage Modulus by DMA @25°C | Mpa | 25000 | 25914 |
| Storage Modulus by DMA @175°C | Mpa | 3000 | 2119 |
| Storage Modulus by DMA @260°C | Mpa | 1200 | 1203 |
| Water Absorption, 24hr PCT | % | 0.38 | 0.37 |
| Mold Shrinkage after PMC | % | 0.18 | 0.20 |
| Hardness | Shore D | 83 | 81 |
| Package | Mold Cap | Strip Size | Package Size | Die Size | Bump Height |
|---|---|---|---|---|---|
| FCCSP | 0.365mm | 240 * 95 * 0.18 mm | 6.3 * 6.9 mm | 6.35 *5.57 *0.15 mm | 80 µm |
| Item | Hysol GR910 L20 |
|---|---|
| Appearance |  |
| C-Scan |  |
| T-Scan |  |
| Strip Warpage |
2~3 mm |
| Marking | OK |
| Test Item | Qualification Test Condition | Test Results | Test Criterion |
|---|---|---|---|
| Before Test | / | Pass | NA |
| Pre-conditioning |
Moisture Soak: 30°C/60%RH, 192 hours Reflow @ 260°C * 3times |
Pass | J-STD-020E |
| uHAST |
130°C, 85%RH 33.3 psia, unbiased 192 hours |
Pass | JESD22-A118B |
Beta Site Performance in HJ**
| Property / Product | Unit | Commercial | Hysol GR920 A1 |
|---|---|---|---|
| UNCURED PROPERTIES | |||
| Epoxy Type | - | BP | |
| Hardener Type | - | PN/MF | |
| Filler cut | µm | 20 | 20 |
| Filler content | % | 88 | 87.5 |
| Hot Plate Gel time, @ 175°C | s | 30 | 46 |
| Spiral Flow @ 175°C | cm | 99 | 167 |
| TYPICAL CURED PROPERTIES | |||
| Glass Transition Temperature, TMA | °C | 142 | 150 |
| Glass Transition Temperature, DMA | °C | 150 | 151 |
| Coefficient of Thermal Expansion (CTE) α1, TMA | ppm/°C | 9 | 9 |
| Coefficient of Thermal Expansion (CTE) α2, TMA | ppm/°C | 37 | 34 |
| Flexural Strength @25°C | MPa | 175 | 1138 |
| Flexural Modulus @25°C | MPa | 19500 | 21000 |
| Storage Modulus by DMA @25°C | Mpa | 25000 | 24000 |
| Storage Modulus by DMA @175°C | Mpa | 3000 | 2000 |
| Storage Modulus by DMA @260°C | Mpa | 1200 | 1100 |
| Water Absorption, 24hr PCT | % | 0.38 | 0.38 |
| Mold Shrinkage after PMC | % | 0.18 | 0.19 |
| Hardness | Shore D | 83 | 80 |
| Package | Mold Cap | Strip Size | Package Size | Die Size | Bump Height |
|---|---|---|---|---|---|
| FCCSP | 0.37 mm | 240 * 76.3 * 0.18 mm | 14 * 14 mm | 6 * 6* 0.12mm | 80 µm |
| Item | Hysol GR910 L20 |
|---|---|
| Appearance |  |
| C-Scan |  |
| T-Scan |  |
| Strip Warpage |
2 mm |
| Marking | OK |
| Test Item | Qualification Test Condition | Test Results | Test Criterion |
|---|---|---|---|
| Before Test | / | Pass | NA |
| Pre-conditioning |
Moisture Soak: 30°C/60%RH, 192 hours Reflow @ 260°C * 3times |
Pass | J-STD-020E |
| uHAST |
130°C, 85%RH 33.3 psia, unbiased 192 hours |
Pass | JESD22-A118B |
| TCB | -55°C~125°C, 1000 cycles | Pass | JESD22-A104E |
