Hysol GR9810-1PF | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Ultra long flow
- Ultra low warpage
- ATF Resist
Product Description
Hysol GR9810-1PF is a heat curable, state of the art, black, semiconductor epoxy molding compound developed to meet the stringent encapsulation requirements of package on package (POP and SCSP). It is a Green, halogen free product with, excellent dimensional stability, very low mold shrinkage and High Tg. Its chemistry allows for properties that go far beyond the "Standard Green" compound ranges.
Hysol GR9810-1PF and its related product GR9810-1P offer a new technology platform on which Hysol develops epoxy mold compounds for high reliability sensors and modules. Key features of GR9810-1PF are summarized as below.
Reliability
- Improved adhesion promoter and toughening system
- High filler loading (>86%) for lower moisture uptake
- Reduced moisture uptake for best MSL performance (MSL1-3)
Warpage Control
- Multifunctional resin hardener system with high Tg
- High cross-linking degree with special toughening system
- High filler loading for low CTE to minimize thermal mismatch
- High performance stress modifier to reduce internal stress
Wire Sweep Control
- Optimized filler PSD with 75um (-1P) or 45um (-1PF) filler cut
- Low viscosity resin and latent catalyst for ultra long flow
Hysol GR9810-1PF is developed for advanced reliability control. The goal of this technology platform is to introduce an epoxy mold compound capable of passing MSL1 260°C on some devices and at least MSL3 260°C on a stacked CSP (PoP) devices. The benefits do not stop here since this product is resistant to ATF (Automatic transmission fluid) and exhibits ultra low warpage making it an excellent choice for automotive packages. Check reliability test results and typical applications in automotive electronics.
Packaging
TDS, SDS & Technical Documents
- GR9810-1PF TDS Sep11
- CAPLINQEpoxyMoldCompoundHandlingGuide1
Technical Specifications
General Properties
Chemical Properties
Physical Properties
Thermal Properties
Mechanical Properties
Curing Conditions
Additional Information
GR9810-1PF For Automotive Electronics Application
GR9810-1PF shows high reliability, good oil resistance, and excellent temperature recycling performance. GR9810-1PF is highly suitable for automotive electronics encapsulation. The key application advantages of GR9810-1PF:
- Under investigation in transmission control unit application to replace current complex sealed housing designs
- Used in a variety of applications including mobile devices
- Have high Tg (>180°C), low stress, and warpage control
- Ensure long-term reliability against automotive fluids
- Reduce footprint, space, weight, and cost
The ATF resistance results show no negative effect on Tg value and storage modulus of GR9810-1PF after 2 weeks ATF 140°C exposure.
GR9810-1PF ATF Resistance Test
GR9810-1P(F) Data Curves
Comparison with GR 9810-1P
|
Property / Product |
Unit |
Hysol |
Hysol |
|
UNCURED PROPERTIES |
|
||
|
Hot Plate Gel time, @ 175°C |
s |
32 |
40 |
|
Spiral Flow @ 175°C |
in |
60 |
67 |
|
Flammability |
|
V-0 |
V-0 |
|
Halogen-free (Green) |
✔ |
✔ |
|
|
Shelf Life @ 5°C |
months |
12 |
12 |
|
TYPICAL CURED PROPERTIES |
|
||
|
Specific Gravity, g/cc |
g/cc |
1.95 |
1.95 |
|
Glass Transition Temperature |
°C |
170 |
184 |
|
Coefficient of Thermal Expansion (CTE) |
|
11 |
11 40 |
|
Flexural Strength, @25°C |
MPa |
137 |
119 |
|
Flexural Strength, @240°C |
MPa |
19.6 |
19.6 |
|
Flexural Modulus (E), @25°C |
GPa |
20.6 |
20.6 |
|
Flexural Modulus (E), @220°C |
GPa |
2.26 |
2.26 |
|
Moisture Absorption, 24hr PCT |
% |
0.27 |
- |
|
Mold Shrinkage, as molded |
% |
0.10 |
0.15 |
|
Thermal Conductivity |
W/mK |
0.9 |
- |
|
Summary |
|
||
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