LOCTITE HF 250DP
Harmonization Code : 8001.20 | Unwrought tin: Tin alloys
Main features
- 95.5%Sn: 3.8%Ag:0.7%Cu - 96SC Alloy
- Lead free Soldering
- Suitable for reflow in nitrogen
Product Description
LOCTITE HF 250DP solder paste is a halogen-free, no clean, low voiding Pb-free solder paste. It is a low metal content solder paste formulated for dispense applications.
LOCTITE HF 250DP has been optimized to achieve consistent 250 to 300um dots using a 27 gauge needle. It contains a stable resin system and slow evaporating solvents and is suitable for nitrogen reflow.
LOCTITE HF 250DP solder paste is no-clean and is designed to be left on the PCB in many applications post assembly since it does not pose a hazard to long-term reliability. Should there be a specific requirement for residue removal, this may be achieved by using conventional cleaning processes based on solvents such as MULTICORE MCF800
HF250DP
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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No longer availablePackaging
TDS, SDS & Technical Documents
- LOCTITE HF 250DP-EN
- 1747469_MSDS_UT_US_EN
Technical Specifications
General Properties
Physical Properties
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