LOCTITE ABLESTIK ICP 2120
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- CCM bracket grounding
- 50°C Cure temp
- High thermal conductivity
Product Description
LOCTITE ABLESTIK ICP 2120 silver filled silicone MS polymer is developed for conductive bonding in high-volume consumer devices (curing at 50° Celsius and lower by moisture) . It shows excellent adhesion in interfaces such as SUS and Nickel.
LOCTITE ABLESTIK ICP 2120 displays excellent DCR and VR performance. It has a very high thermal conductivity (7 W/mK) and low tensile modulus. This silicon adhesive is used for low temp/moisture curable application for CCM bracket grounding.
LOCTITE ABLESTIK ICP 2120 is a low modulus ECA which will cure at temperatures between 25°C and 50°C by moisture and or heat. As such it can be a good option for battery applications requiring a maximum of 60°C curing temperature.
Cure Schedule
- 30min @ 50°C
ICP2120
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 30 days
Shipping in 12 weeks
Shipping in 35 daysPackaging
TDS, SDS & Technical Documents
- ICP 2120 datapkg 07202022
- LOCTITE-ABLESTIK-ICP-2120-en_US
- MSDS LOCTITE ABLESTIK ICP 2120 issue 02-23 (EN)
- MSDS LOCTITE ABLESTIK ICP 2120 issue 02-23 (DE)
Technical Specifications
Thermal Properties
Physical Properties
Additional Information
- Enables high yield and mass production of production of thin, delicate, heat-sensitive devices
- Facilitates robust CCM operation with excellent electrical grounding performance and protection against ESD
- High reliability electrical and thermal performance
- Highly stable for production adaptability
Recently viewed products
ED-645CM | Two-Part Epoxy Adhesive for General Applications
- Excellent electrical insulation
- Reliable in humid conditions
- High Viscosity
KESTER 5744 Solder Saver
- Effectively removes dross
- Low-fuming and remains stable at soldering temperatures.
- Can be easily skimmed off the pot after use.
3M™ Scotch-Weld™ Epoxy Adhesive DP490
- 90-minute work life supports complex assembly positioning and alignment
- Maintains bond strength across high- and low-temperature operating conditions
- Bonds metals, composites, glass, ceramics, plastics, and wood
3M™ Scotch-Weld™ DP460
- High shear strength
- 60-minute work life
- Easy mixing
3M™ Scotch-Weld™ Epoxy Adhesive DP760
- 2:1 mix ratio
- Non sagging paste
- High temperature resistance
