LOCTITE ABLESTIK ICP 3510

LOCTITE® ABLESTIK ICP 3510  epoxy adhesive is designed for use in automated assembly and in-line curing operations. This electrically conductive, silver plated copper filled epoxy displays good dispense behavior and can cure fast at high temperatures.

Silver-plated Cu filler makes this material way more cost-effective and less prone to silver price fluctuations while maintaining a great amount of the properties that assembly houses are looking for.

LOCTITE® ABLESTIK ICP 3510 is heat resistant after cure, forms a high-strength bond, and is typically used as a component assembly adhesive that can be used for cameras and sensors.

Cure Schedule

• 1hour @ 100°C
• 45minutes @ 120°C
• 30minutes @ 150°C

Can also cure on a hot plate for 60 seconds maximum @ 180 to 190°C