LOCTITE ABLESTIK ICP 4001
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Main features
- Low outgassing
- Low stress interconnects
- Noble components on noble LF
Product Description
LOCTITE® ABLESTIK ICP 4001 Ag filled, silicone-based, one component, electrically conductive adhesive is recommended for use in attaching devices or mount components in circuit assembly applications. It is specifically designed to provide reliable low stress interconnects exposed to prolonged vibrational energy and high operating temperatures.
LOCTITE® ABLESTIK ICP 4001 has been optimised to maintain its flexibility and survive at operating temperatures as high as 200ºC. it has low outgassing and low bleeding during cure. Compared to ICP 4000 it has better adhesion but slightly worse electrical performance.
LOCTITE® ABLESTIK ICP 4001 common applications include and are not limited to:
- Bonding of noble passive components onto noble terminated lead frames for electronic sensors
- Back contact bonding of c-Si PV cells to conductive Ag tracks
Cure Schedule
- 35 minutes @ 140°C
Packaging
TDS, SDS & Technical Documents
- LOCTITE ABLESTIK ICP-4001
- LOCTITE ABLESTIK ICP 4001
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Mechanical Properties
Physical Properties
Additional Information
DMA Analysis
CTE is always the one above Tg as the Tg is always so low in these products that a decent measurement below that temperature is almost impossible with our machines.

ICP 4001 Silver filled silicone compared with ICP 4000 and ICP 4015
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