LOCTITE ABLESTIK ICP 4015

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE ABLESTIK ICP 4015

Main features

  • One component
  • High flexibility
  • Low temperature cure

Product Description

LOCTITE ABLESTIK ICP 4015 is a silicone based, electrically conductive adhesive. It is specially designed for applications where both high flexibility and excellent conductivity are required.

LOCTITE ABLESTIK ICP 4015 is engineered to maintain its flexibility and conductivity at elevated temperatures, up to 200ºC. This adhesive is also formulated to cure at temperatures as low as 80ºC. It is suitable for wearable electronics using flexible printed circuits requiring low temp (max 100ºC) cure.

Cure Schedule:

  • 30 minutes @ 80°C

This is a Recommended schedule but it can vary per application. 60 minutes @ 80°C or 35 minutes @ 140°C will provide more consistent results.

Product Family

ICP4015

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TDS, SDS & Technical Documents
  • Loctite Ablestik ICP 4015
    English (Technical Data Sheet (TDS))
  • Loctite Ablestik ICP 4015 SDS
    English (Safety Data Sheet (SDS))

Technical Specifications

General Properties
Density Density
4.1 kg/m3
Electrical Properties
Volume Resistivity Volume Resistivity
0.0001 Ohms⋅cm
Mechanical Properties
Elongation Elongation
100 %
Physical Properties
Thixotropic index Thixotropic index
2.5
Viscosity Viscosity
22,000 mPa.s

Additional Information

DMA Analysis

CTE is always the one above Tg as the Tg is always so low in these products that a decent measurement below that temperature is almost impossible with our machines.

 

ICP 4015 Low temperature cure adhesive- Comparison chart

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