LOCTITE ABLESTIK QMI505MT
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Electrically conductive
- Low modulus
- Skip Cure
Product Description
LOCTITE® ABLESTIK QMI505MT die attach paste is designed for attachment of integrated circuits and components to advanced metal and ceramic surfaces. A package or device manufactured with LOCTITE ABLESTIK QMI505MT will have good resistance to delamination and “popcorning” after exposure to reflow temperatures.
LOCTITE® ABLESTIK QMI505MT is a hydrophobic, electrically conductive rubberized epoxy with low modulus that reduces inter package stress. This silver filled adhesive has excellent interfacial adhesion strength and is stable at high temperatures. Typically used for SBGA, OFN and TQFP packages and on gold, silver, ceramic, palladium and alloy42 surface finishes.
Skip Cure
- ≥10 seconds @ 200°C
QMI505MT
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TDS, SDS & Technical Documents
- ABLESTIK QMI505MT-EN
- 449627_MSDS_UT_US_EN
