LOCTITE ABLESTIK QMI534
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Hydrophobic
- Void free bondline
- Excellent interfacial adhesion strength
Product Description
LOCTITE® ABLESTIK QMI534 is a Fluoropolymer filled non-conductive adhesive for attachment of integrated circuits and components to advanced substrates, including PBGAs, CSPs, array packages, and stacked die.
LOCTITE® ABLESTIK QMI534 is a white, Bismaleimide resin based, hydrophobic product that is stable and adheres best after repeated exposure at high temperatures. It exhibits excellent interfacial adhesion and is mainly used for semiconductor and non conductive adhesive applications.
Cure Schedule
- ≥6 seconds @ 240°C (SkipCure)
- 15 minutes @ 150°C (Conventional Oven)
QMI534
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TDS, SDS & Technical Documents
- LOCTITE ABLESTIK QMI 534
- LOCTITE ABLESTIK QMI 534
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
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