SACQ | Pb-free Solder Spheres

LINQALLOY SACQ solder spheres are lead free Tin/Silver/Copper/Bismuth/Nickel alloys that contain 92.45% Tin (Sn), 4% Silver (Ag),0.5% Copper (Cu), 3% Bismuth (Bi), and 0.05% Nickel (Ni).

LINQALLOY SACQ solder spheres offer higher reliability than SAC405, in small, and thin devices, particularly in WLCSP and WLFO designs.

Features:

• Excellent Fatigue Resistance
• Compatible with all Flux Types
• Excellent Solder Joint Reliability
• Best Wetting Sn/Ag/Cu/Bi/Ni Alloy

Each jar has a clear label on the lid specifying the solder ball diameter as well as a label on the front identifying the alloy type, the quantity of spheres in the jar, the date of manufacture, and the product lot (or batch) number. This batch number is also tied to a certificate of conformance that is also provided with the solder spheres and ensures the SAC405 solder spheres meet the following quality criteria:

• Tin (Sn): 92.45%
• Silver (Ag): 4%
• Copper (Cu): 0.5%
• Bismuth (Bi): 3%
• Nickel (Ni): 0.05%
• Melting Temperature (Solidus): 211°C
• Melting Temperature (Liquidus): 216°C
• Sphericity: Within 1.5%

Diameter Tolerance

• 0.22mm - 0.48mm (220µm - 480µm) : ± 0.010mm (± 10µm)
• 0.50mm - 0.762mm (500µm - 762µm) : ± 0.025mm (± 25µm)