LINQBOND SMA3611 | SMT Chipbonder
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- solvent-free
- low stress
- low water absorption
Product Description
LINQBOND SMA3611 is a one-component epoxy designed for chip bonding. This resin has medium viscosity and thixotropy. It cures at low temperatures and is suitable for screen printing and dispensing applications. The resin forms strong cured shapes without stringing or slumping, even at high-speed dispensing and with very small dots. The hardened surface does not exhibit surface oiliness.
Once cured, LINQBOND SMA3611 offers good adhesive strength, electrical insulation properties, and excellent chemical and solvent resistance. Stable adhesive strength can be achieved with various SMT (Surface-Mount Technology) applications. This product is well-suited for electronic device encapsulation and chip bonding.
SMA3611
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 16 weeks
Shipping in 16 weeks
Shipping in 16 weeksPackaging
TDS, SDS & Technical Documents
- TDS_LINQBOND SMA-3611
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Additional Information
Storage and Handling
Store and transport in a cool, dry place at temperatures from 2 to 13 °C. Prolonged exposure to room temperature can alter the properties.
The shelf life when stored from 2 to 13 °C is 183 days (6 months).
Recently viewed products
3M™ Scotch-Weld™ Epoxy Adhesive DP190
- 90-minute work life
- 1:1 mix ratio
- High shear and peel strength
ABchimie800UV LED Soft Dual Cure Conformal Coating
- One Component
- Dual Cure (UV LED and Humidity)
- High Edge Coverage
ALPHA NF3000 Water-Soluble Flux
- Water-soluble formulation
- Organic activating system
- Wide thermal window
HumiSeal Thinner 503
- RoHS Directive 2015/863/EU compliant
- Ensures proper viscosity adjustment
- Compatible with HumiSeal 1B12, 1B31, 1B66, and 1B73
